Product overview

Part Number
333-086-559-807
Manufacturer
EDAC
Product Category
Standard Card Edge Connectors
Description
Standard Card Edge Connectors Card Edge Connector

Documents & Media

Datasheets
333-086-559-807

Product Attributes

Board Thickness :
1.57 mm
Contact Plating :
Gold
Mounting Angle :
Right Angle
Mounting Style :
Panel
Number of Positions :
86 Position
Pitch :
3.96 mm

Description

Standard Card Edge Connectors Card Edge Connector

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
HF625-0.005-AC-41 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625
BP100-0.011-00-47 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
HF300P-0.002-00-2 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
SP1200-0.016-00-93 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.016 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200
SP1200-0.009-00-94 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200
HF300P-0.002-00-38 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
SPA2000-0.015-00-81 Bergquist Company 3,000 Thermal Interface Products High Reliability Insulator, 0.015 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000
SPK10-0.006-00-85 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1300/Sil-Pad K-10
PP400-0.009-00-127 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400
SPA2000-0.015-00-76 Bergquist Company 3,000 Thermal Interface Products High Reliability Insulator, 0.015 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000
PP1000-0.009-00-41 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000
SP2000-0.010-AC-57 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 3500/Sil-Pad 2000
SPA2000-0.015-00-53 Bergquist Company 3,000 Thermal Interface Products High Reliability Insulator, 0.015 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000
SPK10-0.006-AC-110 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006" Thick, 1Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10, K10AC-110
BP100-0.011-00-39 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100