Product overview

Part Number
H8501-46
Manufacturer
Harwin
Product Category
Circuit Board Hardware - PCB
Description
Circuit Board Hardware - PCB 0.8MM SOCKET ASSY

Documents & Media

Datasheets
H8501-46

Product Attributes

Product :
Receptacles

Description

Circuit Board Hardware - PCB 0.8MM SOCKET ASSY

Price & Procurement

Associated Product

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

You May Also Be Interested In

Part Manufacturer Stock Description
C264-085-3VE Ohmite 3,000 Heat Sinks HEATSINK FOR TO-264 3 CLIPS, NO FINISH
TXB2P-032-037CB CTS Electronic Components 3,000 Heat Sinks
132-10G Wakefield-Vette 3,000 Heat Sinks High Performance Heat Sinks for Compression Devices
120962 Wakefield-Vette 3,000 Heat Sinks 6 Pass 6'' Buried Tube Liquid Cold Plate
125659 Wakefield-Vette 3,000 Heat Sinks 7.55" Wide x 36" High Aspect Extrusion 19832
PICOHS12M2T2020175KIT TechNexion 3,000 Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
PICOHS12M2T2020075KIT TechNexion 3,000 Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
PICOHS06M2T2020075KIT TechNexion 3,000 Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
5078D842200E Axiomtek 3,000 Heat Sinks Heatsink w/o fan for CEM841/2/3
EDMHSCP12201001 TechNexion 3,000 Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR
conga-QA5/i-HSP-T congatec 3,000 Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.
conga-QA5/i-CSP-B congatec 3,000 Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
conga-QA5/CSP-B congatec 3,000 Heat Sinks Passive cooling solution for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
5078D501200E Axiomtek 3,000 Heat Sinks CEM501 Heatspreader
HSIBQ800-1 iBASE Technology 3,000 Heat Sinks Heat Spreader for IBQ800