Descripción del producto
- Número de parte
- 342000F00000G
- Fabricante
- Aavid, Thermal Division of Boyd Corporation
- categoria de producto
- Disipadores de calor
- Descripción
- Heat Sinks Thin-Fin, Stamped Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
Documentos y Medios
- Hojas de datos
- 342000F00000G
Atributos del producto
- Designed for :
- BGA, PGA, QFP
- Heatsink Material :
- Copper
- Height :
- 0.33 mm
- Length :
- 101.6 mm
- Mounting Style :
- Adhesive
- Product :
- Heat Sinks
- Width :
- 25.4 mm
Descripción
Heat Sinks Thin-Fin, Stamped Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm
Precio y Adquisiciones
Producto asociado
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