Descripción del producto

Número de parte
342000F00000G
Fabricante
Aavid, Thermal Division of Boyd Corporation
categoria de producto
Disipadores de calor
Descripción
Heat Sinks Thin-Fin, Stamped Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm

Documentos y Medios

Hojas de datos
342000F00000G

Atributos del producto

Designed for :
BGA, PGA, QFP
Heatsink Material :
Copper
Height :
0.33 mm
Length :
101.6 mm
Mounting Style :
Adhesive
Product :
Heat Sinks
Width :
25.4 mm

Descripción

Heat Sinks Thin-Fin, Stamped Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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