sales@szcinty.com
Descripción del producto
- Número de parte
- GJM0335C1H7R9WB01D
- Fabricante
- Murata Electronics
- categoria de producto
- Capacitores cerámicos multicapa MLCC - SMD/SMT
- Descripción
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 0201 50VDC 7.9pF Tol 0.05pF
Documentos y Medios
- Hojas de datos
- GJM0335C1H7R9WB01D
Atributos del producto
- Capacitance :
- 7.9 pF
- Case Code - in :
- 0201
- Case Code - mm :
- 0603
- Dielectric :
- C0G (NP0)
- Height :
- 0.3 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Product :
- RF Microwave / High Q
- Series :
- GJM
- Termination :
- Standard
- Termination Style :
- SMD/SMT
- Tolerance :
- 0.05 pF
- Voltage Rating DC :
- 50 VDC
Descripción
Multilayer Ceramic Capacitors MLCC - SMD/SMT 0201 50VDC 7.9pF Tol 0.05pF
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
| Parte | Fabricante | Existencias | Descripción |
|---|---|---|---|
| HF300P-0.002-00-80 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SP1200-0.016-AC-124 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| SPA2000-0.015-AC-20 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.015 Inch Thick, 1 Side Adhesive, Sil-Pad TSP A3000/Sil-Pad A2000 |
| HF650P-0.002-01-82 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| PPK4-0.006-00-100 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| SP1200-0.016-AC-125 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| SP2000-0.010-AC-66 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.010 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 3500/Sil-Pad 2000 |
| SPK6-0.006-00-7 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |
| SPA2000-0.020-00-115 | Bergquist Company | 3,000 | Thermal Interface Products High Reliability Insulator, 0.020 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000 |
| SPK4-0.006-00-100 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| HF650P-0.002-01-19 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| HF650P-0.0015-01-94 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SP1500ST-0.008-02-122 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST |
| BP100-0.008-00-99 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF625-0.005-00-24 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
