Descripción del producto
- Número de parte
- HB330MFZRE
- Fabricante
- TE Connectivity / Holsworthy
- categoria de producto
- Resistencias de película gruesa: orificio pasante
- Descripción
- Thick Film Resistors - Through Hole HB03RE 30M 1% 100PPM
Documentos y Medios
- Hojas de datos
- HB330MFZRE
Atributos del producto
- Features :
- -
- Height :
- 10.4 mm
- Lead Diameter :
- 0.6 mm
- Lead Spacing :
- 5 mm
- Length :
- 52 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Bulk
- Power Rating :
- 2 W
- Product :
- Thick Film Resistors Leaded
- Resistance :
- 30 mOhms
- Series :
- HB
- Temperature Coefficient :
- 100 PPM / C
- Termination Style :
- Radial
- Tolerance :
- 1 %
- Type :
- High Value, High Voltage Resistors
- Voltage Rating :
- 15 kV
- Width :
- 3 mm
Descripción
Thick Film Resistors - Through Hole HB03RE 30M 1% 100PPM
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
Parte | Fabricante | Existencias | Descripción |
---|---|---|---|
HF625-0.005-00-33 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
SP800-0.005-00-44 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
HF625-0.005-00-119 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
SPK4-0.006-00-28 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
SP1100ST-0.012-02-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
SP400-0.007-00-132 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
BP100-0.008-00-52 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
SP400-0.007-AC-83 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
HF625-0.005-00-45 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
SPA1500-0.010-00-19 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500 |
SP800-0.005-AC-94 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
SP1100ST-0.012-02-45 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
SPA2000-0.015-00-42 | Bergquist Company | 3,000 | Thermal Interface Products High Reliability Insulator, 0.015 Inch Thick, Sil-Pad TSP A3000/Sil-Pad A2000 |
HF300P-0.001-00-120 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
Q3-0.005-00-61 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3 |