Descripción del producto
- Número de parte
- CRCW25122K40JNEG
- Fabricante
- Vishay / Dale
- categoria de producto
- Resistencias de película gruesa - SMD
- Descripción
- Thick Film Resistors - SMD 1watt 2.4Kohms 5%
Documentos y Medios
- Hojas de datos
- CRCW25122K40JNEG
Atributos del producto
- Application :
- Automotive Grade
- Case Code - in :
- 2512
- Case Code - mm :
- 6332
- Features :
- -
- Maximum Operating Temperature :
- + 155 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, MouseReel, Reel
- Power Rating :
- 1 W
- Qualification :
- AEC-Q200
- Resistance :
- 2.4 kOhms
- Series :
- D/CRCW e3
- Temperature Coefficient :
- 200 PPM / C
- Tolerance :
- 5 %
- Voltage Rating :
- 500 V
Descripción
Thick Film Resistors - SMD 1watt 2.4Kohms 5%
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
Parte | Fabricante | Existencias | Descripción |
---|---|---|---|
SP400-0.007-AC-125 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007" Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
SP400-0.007-AC-104 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007" Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
SP400-0.007-AC-58 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400, BG95752 |
HF300P-0.0015-00-44 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
8329TCS-50ML | MG Chemicals | 3,000 | Thermal Interface Products Adhesive - Thermal Conductive Epoxy, Slow Cure (RATIO 1:1) |
SP400-0.007-00-102 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400, BG425123, IDH 2190942 |
SP1200-0.016-AC-62 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
SP400-0.009-AC-62 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
SP900S-0.009-AC-12 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S |
1-5-8810 | 3M Electronic Specialty | 3,000 | Thermal Interface Products |
SPK10-0.006-AC-122 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10 |
BP100-0.005-00-77 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100, BG419982 |
SPK10-0.006-AC-133 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006" Thick, 1Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10, K10AC-133 |
8329TCS-200ML | MG Chemicals | 3,000 | Thermal Interface Products Adhesive - Thermal Conductive Epoxy, Slow Cure (RATIO 1:1)) |
SP900S-0.009-00-56 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S |