Descripción del producto

Número de parte
CRCW25122K40JNEG
Fabricante
Vishay / Dale
categoria de producto
Resistencias de película gruesa - SMD
Descripción
Thick Film Resistors - SMD 1watt 2.4Kohms 5%

Documentos y Medios

Hojas de datos
CRCW25122K40JNEG

Atributos del producto

Application :
Automotive Grade
Case Code - in :
2512
Case Code - mm :
6332
Features :
-
Maximum Operating Temperature :
+ 155 C
Minimum Operating Temperature :
- 55 C
Packaging :
Cut Tape, MouseReel, Reel
Power Rating :
1 W
Qualification :
AEC-Q200
Resistance :
2.4 kOhms
Series :
D/CRCW e3
Temperature Coefficient :
200 PPM / C
Tolerance :
5 %
Voltage Rating :
500 V

Descripción

Thick Film Resistors - SMD 1watt 2.4Kohms 5%

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Usted también podría estar interesado en

Parte Fabricante Existencias Descripción
SP400-0.007-AC-125 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007" Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
SP400-0.007-AC-104 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007" Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
SP400-0.007-AC-58 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400, BG95752
HF300P-0.0015-00-44 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
8329TCS-50ML MG Chemicals 3,000 Thermal Interface Products Adhesive - Thermal Conductive Epoxy, Slow Cure (RATIO 1:1)
SP400-0.007-00-102 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400, BG425123, IDH 2190942
SP1200-0.016-AC-62 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200
SP400-0.009-AC-62 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
SP900S-0.009-AC-12 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S
1-5-8810 3M Electronic Specialty 3,000 Thermal Interface Products
SPK10-0.006-AC-122 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10
BP100-0.005-00-77 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100, BG419982
SPK10-0.006-AC-133 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006" Thick, 1Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10, K10AC-133
8329TCS-200ML MG Chemicals 3,000 Thermal Interface Products Adhesive - Thermal Conductive Epoxy, Slow Cure (RATIO 1:1))
SP900S-0.009-00-56 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S