Descripción del producto

Número de parte
H863R4BZA
Fabricante
TE Connectivity / Holsworthy
categoria de producto
Resistencias de película metálica
Descripción
Metal Film Resistors - Through Hole H8 63R4 0.1% 100PPM

Documentos y Medios

Hojas de datos
H863R4BZA

Atributos del producto

Diameter :
2.5 mm
Length :
7.2 mm
Maximum Operating Temperature :
+ 155 C
Minimum Operating Temperature :
- 55 C
Packaging :
Bulk
Power Rating :
250 mW (1/4 W)
Resistance :
63.4 Ohms
Series :
H8
Temperature Coefficient :
100 PPM / C
Termination Style :
Axial
Tolerance :
0.1 %

Descripción

Metal Film Resistors - Through Hole H8 63R4 0.1% 100PPM

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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