Descripción del producto
- Número de parte
- CFR25SJT-52A470K
- Fabricante
- YAGEO
- categoria de producto
- Resistencias de película de carbono
- Descripción
- Carbon Film Resistors - Through Hole
Documentos y Medios
- Hojas de datos
- CFR25SJT-52A470K
Atributos del producto
- Diameter :
- 1.9 mm
- Length :
- 3.4 mm
- Maximum Operating Temperature :
- + 155 C
- Minimum Operating Temperature :
- - 55 C
- Power Rating :
- 250 mW (1/4 W)
- Resistance :
- 470 kOhms
- Temperature Coefficient :
- - 350 PPM / C, + 500 PPM / C
- Termination Style :
- Axial
- Tolerance :
- 5 %
- Voltage Rating :
- 200 V
Descripción
Carbon Film Resistors - Through Hole
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
Parte | Fabricante | Existencias | Descripción |
---|---|---|---|
tBOX324-894-FL-i3-DIO-TMDC-CAN-GND | Axiomtek | 3,000 | Embedded Box Computers Fanless marine embedded system with Intel i3-7100U 3965U 2.2 GHz processor 4 USB VGA DVI-I 4 GbE LANs (RJ-45) 3 COM CAN DIO two 2.5" SATA trays TB 3P DC-in?w/ GND?14 32VDC |
MVP-6021/M16G | ADLINK Technology | 3,000 | Embedded Box Computers MVP-6021/M16G Intel Skylake-S i7-6700TE+Q170, 2x8GB DDR4 SODIMM, VGA+DVI-D, 2xDP, 3xGbe, 4xUSB3.0, 2xUSB2.0, 1xSATA, 1xCFAST, 1xmPCIe, 1xUSIM, 4xCOM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex16+2PCI slots, 12~24V DC-IN |
MVP-6025/M16G | ADLINK Technology | 3,000 | Embedded Box Computers MVP-6025/M16G Intel Skylake-S i7-6700+Q170, 2x8GB DDR4 SODIMM, VGA+DVI-D, 2xDP, 3xGbe, 4xUSB3.0, 2xUSB2.0, 1xSATA, 1xCFAST, 1xmPCIe, 1xUSIM, 4xCOM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex16+2PCI slots, 12~24V DC-IN |
MVP-6001/M32G | ADLINK Technology | 3,000 | Embedded Box Computers Intel Skylake-S i7-6700TE+H110, 2x16GB DDR4 SODIMM,VGA+DVI-D, 2xDP, 3xGbe, 4xUSB3.0, 2xUSB2.0,1xSATA, 1xCFAST, 1xmPCIe, 1xUSIM, 4xCOM, 8DI+8DO,Line-Out+MIC-IN, 1PCIex16+1PCI slots, 12~24V DC-IN |
tBOX324-894-FL-i7-M12-MVDC | Axiomtek | 3,000 | Embedded Box Computers Fanless Vehicle Grade embedded system i7-7600U 2.8-3.9GHz processor USB*4 VGA+DVI Giga M12 LAN*4 COM*3 CAN*1 M12 DC 9 to 36VDC ACC ignition |
MXC-6403D/M8G | ADLINK Technology | 3,000 | Embedded Box Computers Intel Skylake-H Core i3 CPU+QM170 fanless expandable computer,1PCI+2PCIex8,2DP+1DVI-I,3xGbE,6xUSB3.0,4xCOM,16-CH DIO,1xCfast socket,4x2.5" SATA port,9-32VDC input,8G DDR4 |
2-A0DK-2003 | Kontron | 3,000 | Embedded Box Computers KBox C-102-45-43100000-00000-0-0 |
Talos-2310/M4G/500G HDD | ADLINK Technology | 3,000 | Embedded Box Computers 1-CH EtheCAT & 4-CH GigE vision Automation Control System, i6100, 4G RAM, 500G HDD |
tBOX500-510-FL-i5-24-110MRDC | Axiomtek | 3,000 | Embedded Box Computers Fanless railway embedded system Intel Core i5-7300U 2.6 3.5 GHz processor 4 USB 3.0 DVI-I RJ-45 LAN serial console Mic-in/Line-out two 2.5" SATA trays M12 A-code 5P DC-in and 16.8 137.5VDC |
tBOX324-894-FL-i36100U-DIO-110MRDC-CAN-G | Axiomtek | 3,000 | Embedded Box Computers Fanless embedded system with 6th gen Intel Skylake Core i3-6100U for railway PC?4 USB 3.0?DVI-I?4 M12 GbE LANs?3 COM?CAN?DIO?Mic-in & Line-out?two 2.5" SATA trays?M12 DC-in?and 110 VDC |
tBOX324-894-FL-i3-DIO-110MRDC-CAN-G | Axiomtek | 3,000 | Embedded Box Computers Fanless railway grade embedded system i3- 7100U processor four USB VGA+DVI Giga M12 four LAN three COM CAN DIO?w/ GND?77 137.5VDC M12 DC-in |
TREK-674-LWB7B0E | Advantech | 3,000 | Embedded Box Computers TREK-674 W/WWAN(US)/GPS/WLAN/BT/SSD/WES8 |
ITA-2230-00A1E | Advantech | 3,000 | Embedded Box Computers Intel Core i7, 4G on board memory, Single AC/DC power input, 2U Rackmount |
MVP-6025/M16G/Fan | ADLINK Technology | 3,000 | Embedded Box Computers MVP-6025/M16G/Fan Intel Skylake-S i7-6700+Q170, 16GB DDR4 SODIMM, VGA+DVI-D, 2xDP, 3xGbe, 4xUSB3.0, 2xUSB2.0, 1xSATA, 1xCFAST, 1xmPCIe, 1xUSIM, 4xCOM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex16+2PCI slots, 12~24V DC-IN, with Fan |
MXC-662X/M4G | ADLINK Technology | 3,000 | Embedded Box Computers |