Descripción del producto

Número de parte
C1812C270MCTACAUTO
Fabricante
KEMET Electronics
categoria de producto
Capacitores cerámicos multicapa MLCC - SMD/SMT
Descripción
Multilayer Ceramic Capacitors MLCC - SMD/SMT 500Vol 27pF X8G 1812 20% AEC-Q200

Documentos y Medios

Hojas de datos
C1812C270MCTACAUTO

Atributos del producto

Dielectric :
X8G
Maximum Operating Temperature :
+ 150 C
Minimum Operating Temperature :
- 55 C
Packaging :
Cut Tape, Reel
Qualification :
AEC-Q200
Series :
SMD COMM X8G HVHT150C
Termination :
Standard
Termination Style :
SMD/SMT

Descripción

Multilayer Ceramic Capacitors MLCC - SMD/SMT 500Vol 27pF X8G 1812 20% AEC-Q200

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Usted también podría estar interesado en

Parte Fabricante Existencias Descripción
TX0522ND CTS Electronic Components 3,000 Heat Sinks Electrically Isolated Heat Sink for TO-5 Pkg / Type: Chassis or PCB Mount//Pkg Cooled: TO-5/ Attachment Method: 4-40 female nut/ Shape: cylindrical/ Length: 0.47" (11.9mm)/ Width 0.375" (9.65mm)/Inside Diameter: 0.295" (7.5mm)/ Thermal resistan
125557 Wakefield-Vette 3,000 Heat Sinks 4.921" Wide x 36" Power Module Extrusion 13698 xx5658
533202B02551G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Extruded Style Heat Sink for TO-220, Radial Fins, Vertical Mounting, 9 n Thermal Resistance, Black Anodized, 2.67mm Hole, 50.8x18.29x15.88mm
533702B02552G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Extruded Style Heat Sink for TO-220, Large Radial Fins, Vertical Mounting, 5.7 n Thermal Resistance, Black Anodized, 2.67mm, Device Clip #52 Hole, 25.4x18.29mm
1116BG Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Thermal Link
581102B02100G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Board Level, Extruded Heat Sink for TO-220, Flat Back Extra, Vertical Mounting, Black Anodized, 16.26x16.26x38.1mm
374824B00032G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x25mm, IC Pkg Size = 35 x 35, Tape #32
574902B04300G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Board Level, Stamped Heat Sink for TO-220, Vertical Mounting, 9.02x21.84x34.93mm
529801B02100G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Board Level Heat Sink for TO-218, Vertical Mounting, Black Anodized, 38.1x41.91x25.40mm
591202B03100G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Plug-In Style, Stamped Heat Sink for TO-220, Four Spring Action Clips, Horizontal Mounting, 26.8 n Thermal Resistance, 1.73mm Hole
127786 Wakefield-Vette 3,000 Heat Sinks Extrusion Cut to Length, 6.00 Inch Width, 36 Inch Length, Long High Aspect Heat Sink 19767, 0.49 Thermal Resistance C/w/3
125572 Wakefield-Vette 3,000 Heat Sinks 10.08" Wide x 36" High Aspect Extrusion 21052
335224B00034G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Heat Sink for Plastic BGA Packages, Black Anodized, 25x25x9.9mm, IC Pkg Size = 25 x 25, Tape #34
375424B00000G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks BGA Heat Sink, 15.2x15.2x6.35mm, No Tape Attachment
241409B92200G Aavid, Thermal Division of Boyd Corporation 3,000 Heat Sinks Heat Sink for Quarter Brick DC/DC Converters, Crosswise Fins, 22.9mm Height