sales@szcinty.com
Descripción del producto
- Número de parte
- TAJB685M016YNJ
- Fabricante
- Kyocera AVX
- categoria de producto
- Capacitores de tantalio - SMD sólido
- Descripción
- Tantalum Capacitors - Solid SMD 16V 6.8uF 20%
Documentos y Medios
- Hojas de datos
- TAJB685M016YNJ
Atributos del producto
- Capacitance :
- 6.8 uF
- Case Code - in :
- 1210
- Case Code - mm :
- 3528
- ESR :
- 2.5 Ohms
- Height :
- 1.9 mm
- Maximum Operating Temperature :
- + 125 C
- Mfr Case Code :
- B Case
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, MouseReel, Reel
- Series :
- TAJ
- Termination Style :
- SMD/SMT
- Tolerance :
- 20 %
- Voltage Rating DC :
- 16 VDC
Descripción
Tantalum Capacitors - Solid SMD 16V 6.8uF 20%
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
| Parte | Fabricante | Existencias | Descripción |
|---|---|---|---|
| SPK10-0.006-00-35 | Bergquist Company | 490 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1300/Sil-Pad K-10, BG80035 |
| SP400-0.009-00-101 | Bergquist Company | 654 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400, BG429439, IDH 2191890 |
| 56-77-10G | Aavid, Thermal Division of Boyd Corporation | 3,168 | Thermal Interface Products Mica Insulator for TO-220, 21.89mm |
| 110G | Aavid, Thermal Division of Boyd Corporation | 553 | Thermal Interface Products Teflon-Filled Acetal Bushings for TO-3, 5.03/5.21mm ID, 6.81/6.98mm OD, 1.57/1.40mm Thickness |
| SPA2000-0.015-00-104 | Bergquist Company | 1,161 | Thermal Interface Products Sil-Pad, 0.015" Thick, Dimensions: 1.000x0.750", Sil-Pad TSP A3000/Sil-Pad A2000 |
| PP1000-0.009-00-24 | Bergquist Company | 1,592 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000, PP1000-24, BG91415 |
| TCF 2000 AF | Bergquist Company | 24 | Thermal Interface Products Phase Change TIM, LOCTITE TCF 2000 AF, Also Known as Thermstrate, AF-S-10H-10B |
| SPK10-0.006-00-05 | Bergquist Company | 963 | Thermal Interface Products Sil-Pad, 0.006" Thick, Dimensions: 1.650x1.140", Sil-Pad TSP K1300/Sil-Pad K-10 |
| SP900S-0.009-00-2 | Bergquist Company | 2,369 | Thermal Interface Products Sil-Pad, 0.009" Thick, Dimensions: 1.78x1.25", Sil-Pad TSP 1600S/Sil-Pad 900S |
| CD-02-05-C-46 | Wakefield-Vette | 466 | Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.811 Inch x 1.811 Inch, No Hole |
| 8903VBG | Aavid, Thermal Division of Boyd Corporation | 831 | Thermal Interface Products Insulating Covers for TO-3, Black, Self-Extinguishing UL 94 V-0 UL 492 Type 1, Thermoplastic Polyester |
| GPVOUS-0.200-AC | Bergquist Company | 46 | Thermal Interface Products GAP PAD, 0.200", 1Side Adhesive, GAP PAD TGP 1000VOUS/GAP PAD VO Ultra Soft |
| 100000F00000G | Aavid, Thermal Division of Boyd Corporation | 133 | Thermal Interface Products Ther-O-Link Silicone-Based Thermal Compound, White, 1 Gram (0.03 oz) Ampule |
| 1130BG | Aavid, Thermal Division of Boyd Corporation | 8 | Thermal Interface Products Thermal Link with BeO Insulator for TO-5, Vertical Mounting, Black Anodized, 15 n Thermal Resistance |
| HF300G-0.005-00-1012 | Bergquist Company | 46 | Thermal Interface Products Phase Change TIM, 10x12" SH, 0.005", Hi-Flow THF 1600G/Hi-Flow 300G |
