Descripción del producto

Número de parte
97-3106A18-1SY-946
Fabricante
Amphenol Industrial
categoria de producto
Conector de especificación circular MIL
Descripción
Circular MIL Spec Connector AB 10C 10#16 SKT PLUG

Documentos y Medios

Hojas de datos
97-3106A18-1SY-946

Atributos del producto

Contact Gender :
Socket (Female)
Contact Material :
Copper Alloy
Contact Plating :
Silver
Insert Arrangement :
18-01
MIL Type :
MIL-DTL-5015
Mounting Style :
Cable Mount
Number of Positions :
10 Position
Product :
Connectors
Shell Size :
18
Shell Style :
Straight
Termination Style :
Solder

Descripción

Circular MIL Spec Connector AB 10C 10#16 SKT PLUG

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Usted también podría estar interesado en

Parte Fabricante Existencias Descripción
SP1200-0.016-00-62 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.016 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200
SPK6-0.006-AC-36 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6
BP100-0.005-00-70 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SP800-0.005-00-101 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800
SP800-0.005-AC-31 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800
SP2000-0.020-AC-78 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.020 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 3500/Sil-Pad 2000
SP800-0.005-AC-36 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800
HF300P-0.0015-00-30 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
SP980-0.009-AC-25 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980
BP100-0.011-00-23 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
BP100-0.011-00-21 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100, BP111-20
SP980-0.009-00-73 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
QII-0.006-AC-17 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II
SP980-0.009-AC-48 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980
Q3-0.005-AC-92 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3