Descripción del producto
- Número de parte
- YDTS24T19-11ADV001
- Fabricante
- TE Connectivity / DEUTSCH
- categoria de producto
- Conector de especificación circular MIL
- Descripción
- Circular MIL Spec Connector RECP ASSY
Documentos y Medios
- Hojas de datos
- YDTS24T19-11ADV001
Atributos del producto
- Contact Gender :
- Without Pin Contacts
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 13 A
- Insert Arrangement :
- 19-11
- MIL Type :
- MIL-DTL-38999 III
- Mounting Style :
- Panel
- Number of Positions :
- 11 Position
- Product :
- Receptacles
- Series :
- DTS24
- Shell Size :
- 19
- Shell Style :
- Jam Nut
- Termination Style :
- Crimp
Descripción
Circular MIL Spec Connector RECP ASSY
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
Parte | Fabricante | Existencias | Descripción |
---|---|---|---|
BP100-0.005-00-83 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
Q3-0.005-AC-40 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
HF650P-0.0015-01-65 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
PP1000-0.009-AC-96 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000 |
SPK10-0.006-AC-33 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10 |
HF650P-0.0015-01-28 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
SPK6-0.006-AC-117 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6 |
PP1000-0.009-AC-76 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000 |
HF300P-0.0015-00-47 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
PP1000-0.009-AC-102 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000 |
HF650P-0.0015-01-84 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
PP400-0.009-AC-80 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400 |
SPK6-0.006-00-66 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |
SP1200-0.009-00-81 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
PP1000-0.009-AC-57 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000 |