Descripción del producto
- Número de parte
- 310-87-119-01-640101
- Fabricante
- Preci-Dip
- categoria de producto
- Cabeceras y carcasas de cables
- Descripción
- Headers & Wire Housings
Documentos y Medios
- Hojas de datos
- 310-87-119-01-640101
Atributos del producto
- Contact Gender :
- Socket (Female)
- Contact Plating :
- Gold
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Mounting Style :
- Through Hole
- Number of Positions :
- 19 Position
- Number of Rows :
- 1 Row
- Pitch :
- 2.54 mm
- Product :
- Headers
- Row Spacing :
- -
- Series :
- 310
- Termination Post Length :
- 3.17 mm
- Termination Style :
- Solder Pin
- Type :
- Socket
Descripción
Headers & Wire Housings
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
Parte | Fabricante | Existencias | Descripción |
---|---|---|---|
OMNI-UNI-18-25 | Wakefield-Vette | 3,000 | Heat Sinks OmniKlip Heat Sink , 18mm wide, 25mm long, black anodized for TO-247 |
403A | Wakefield-Vette | 3,000 | Heat Sinks Extruded Heat Sink for Power Semiconductors T03, Stud Mount |
563002D00000G | Aavid, Thermal Division of Boyd Corporation | 4,986 | Heat Sinks Channel Style, Stamped Heat Sink with Three Integrated Tabs for TO-220, Vertical Mounting, 13 n Thermal Resistance, Tin Plated, 3.10mm Hole, 29.97mm |
HSS-B20-061H-03 | CUI Devices | 3,000 | Heat Sinks 19 x 13 x 12.7mm TO-220 solder pin |
122260 | Wakefield-Vette | 3,000 | Heat Sinks 19035 Profile Cut to 12 Inches |
MA-302-55E | Ohmite | 100 | Heat Sinks HTSNK TO-247 TO-264 Degreased |
908-35-1-23-2-B-0 | Wakefield-Vette | 3,000 | Heat Sinks Chipset Heat Sink with Clip, Elliptical, 35mm Chip Size, 22.6mm Height, Aluminum, Black Anodized |
conga-SA5/HSP-B | congatec | 3,000 | Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. |
THSM-nXBT-B | ADLINK Technology | 3,000 | Heat Sinks Medium profile heatsink for NanoX-BT with threaded standoffs for bottom mounting |
THSH-BD7-BL | ADLINK Technology | 3,000 | Heat Sinks High profile heatsink for Express-BD7 with threaded standoffs for bottom mounting |
910-40-1-23-2-B-0 | Wakefield-Vette | 3,000 | Heat Sinks Chipset Heat Sink with Clip, Elliptical, 40mm Chip Size, 22.6mm Height, Aluminum, Black Anodized |
HTS-cHL-B | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for cExpress-HL with threaded standoffs for bottom mounting |
1960050950N001 | Advantech | 3,000 | Heat Sinks COM-Ultra 2nd-pc heatsink |
1960048818N001 | Advantech | 3,000 | Heat Sinks COM Express Basic 2nd-pc heatsink |
HTS-cHL-BT | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for cExpress-HL with through hole standoffs for top mounting |