Descripción del producto

Número de parte
M83723/85R22556
Fabricante
Amphenol Aerospace
categoria de producto
Conector de especificación circular MIL
Descripción
Circular MIL Spec Connector 55C 55#20 PIN RECP

Documentos y Medios

Hojas de datos
M83723/85R22556

Atributos del producto

Series :
Matrix 83723 III

Descripción

Circular MIL Spec Connector 55C 55#20 PIN RECP

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Usted también podría estar interesado en

Parte Fabricante Existencias Descripción
M47098B011000G Aavid, Thermal Division of Boyd Corporation 485 Heat Sinks Max Clip, Board Level Heat Sink for TO 247, TO 220, TO 126, Aluminum, Solderable Pins, Black Anodized, 19.4x24.89x31.5mm (WxLxH), 665871
219-263A Wakefield-Vette 292 Heat Sinks TO-263 HEAT SINK ANODZD
SKV38538514-CU Wakefield-Vette 80 Heat Sinks COPPER HEATSINK 38.5X37.6X14MM
HSB12-272706 CUI Devices 1,513 Heat Sinks heat sink, BGA, 27 x 27 x 6 mm
HSB14-353518 CUI Devices 1,208 Heat Sinks heat sink, BGA, 35 x 35 x 18 mm
125313 Wakefield-Vette 50 Heat Sinks 2.875" Wide x 12" Flatback heatsink 16078 xx2013
HSB08-212106 CUI Devices 1,844 Heat Sinks heat sink, BGA, 21 x 21 x 6 mm
HSB06-181810 CUI Devices 1,944 Heat Sinks heat sink, BGA, 18 x 18 x 10 mm
SKV4545225-CU Wakefield-Vette 108 Heat Sinks COPPER HEATSINK 45X44X22.5MM
SKV606014-CU Wakefield-Vette 44 Heat Sinks COPPER HEATSINK 60X60X14MM
HSB19-272718 CUI Devices 660 Heat Sinks heat sink, BGA, 27 x 27 x 18 mm
M48098B011000G Aavid, Thermal Division of Boyd Corporation 410 Heat Sinks Max Clip, Board Level Heat Sink for TO 247, TO 220, TO 126, Aluminum, One-Two Solderable Pins, Black Anodized, 22x24.89x38.5mm (WxLxH), 665880
960-31-12-D-AB-0 Wakefield-Vette 163 Heat Sinks HEATSINK 31X12MM DIAGONAL PLASTIC PUSH PIN
SKV4545225-AL Wakefield-Vette 68 Heat Sinks ALUMINUM HEATSINK 45X44X22.5MM
125325 Wakefield-Vette 45 Heat Sinks 3.79" Wide x 12" Flatback heatsink 16304 xx5079