Descripción del producto

Número de parte
S-100-SP-10-D-S
Fabricante
IDI / Smiths Interconnect
categoria de producto
Sondas de contacto
Descripción
Contact Probes HEADLESS CHSLD SPEAR STEEL

Documentos y Medios

Hojas de datos
S-100-SP-10-D-S

Atributos del producto

Current Rating :
3 A
Length :
33.27 mm
Series :
S-100
Spring Force :
10 oz
Tip Style :
Spear
Travel :
4.32 mm
Type :
Probes

Descripción

Contact Probes HEADLESS CHSLD SPEAR STEEL

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Usted también podría estar interesado en

Parte Fabricante Existencias Descripción
HF650P-0.001-01-135 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
SP900S-0.009-AC-68 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S
Q3-0.005-00-82 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3
HF300P-0.002-00-88 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
QII-0.006-AC-9 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II
SP980-0.009-00-120 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
SP400-0.007-AC-38 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007" Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400
SPA1500-0.010-00-18 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500
PP400-0.009-00-99 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400
SP800-0.005-00-115 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800
SP1200-0.016-AC-85 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200
SP400-0.007-00-30 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400
SP980-0.009-00-35 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
Q3-0.005-AC-60 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3
HF650P-0.001-01-67 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P