Descripción del producto

Número de parte
504187-2670
Fabricante
Molex
categoria de producto
Cabeceras y carcasas de cables
Descripción
Headers & Wire Housings EMBS PACKAGE FOR 504187 26P

Documentos y Medios

Hojas de datos
504187-2670

Atributos del producto

Application :
Wire-to-Board
Contact Gender :
Pin (Male)
Contact Plating :
Tin
Maximum Operating Temperature :
+ 85 C
Minimum Operating Temperature :
- 25 C
Mounting Angle :
Straight
Mounting Style :
SMD/SMT
Number of Positions :
26 Position
Number of Rows :
2 Row
Packaging :
Cut Tape, Reel
Pitch :
1.25 mm
Product :
Headers
Row Spacing :
2.86 mm
Series :
504187
Termination Style :
Solder
Tradename :
Micro-Lock
Type :
Shrouded

Descripción

Headers & Wire Housings EMBS PACKAGE FOR 504187 26P

Precio y Adquisiciones

Producto asociado

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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