sales@szcinty.com
Descripción del producto
- Número de parte
- MKP4J023303C00JF00
- Fabricante
- WIMA
- categoria de producto
- Condensadores de película
- Descripción
- Film Capacitors MKP 4 0.033 F 630 VDC 4x9x13 PCM10
Documentos y Medios
- Hojas de datos
- MKP4J023303C00JF00
Atributos del producto
- Capacitance :
- 0.033 uF
- Dielectric :
- Polypropylene (PP)
- Height :
- 9 mm
- Lead Spacing :
- 10 mm
- Lead Style :
- Straight
- Length :
- 13 mm
- Maximum Operating Temperature :
- + 100 C
- Minimum Operating Temperature :
- - 55 C
- Number of Pins :
- 2 Pin
- Product :
- General Film Capacitors
- Series :
- MKP 4
- Termination Style :
- Radial
- Tolerance :
- 5 %
- Voltage Rating AC :
- 280 VAC
- Voltage Rating DC :
- 630 VDC
- Width :
- 4 mm
Descripción
Film Capacitors MKP 4 0.033 F 630 VDC 4x9x13 PCM10
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
| Parte | Fabricante | Existencias | Descripción |
|---|---|---|---|
| HF300P-0.001-00-13 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| PPK4-0.006-AC-119 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| HF300P-0.001-00-19 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| HF625-0.005-AC-4 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
| SP1100ST-0.012-02-82 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| SPK6-0.006-AC-22 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006" Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6, K6AC-22 |
| HF650P-0.0015-01-89 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SP800-0.005-00-27 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
| Q3-0.005-AC-97 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
| SPK6-0.006-00-63 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |
| QII-0.006-00-16 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/aka Q-Pad II |
| HF300P-0.002-00-44 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| HF650P-0.0015-01-4 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SP900S-0.009-00-102 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S |
| HF300P-0.001-00-20 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
