sales@szcinty.com
Documentos y Medios
- Hojas de datos
- MT41K128M16JT-107 AAT:K TR
Atributos del producto
- Data Bus Width :
- 16 bit
- Maximum Clock Frequency :
- 933 MHz
- Maximum Operating Temperature :
- + 105 C
- Memory Size :
- 2 Gbit
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- SMD/SMT
- Organization :
- 128 M x 16
- Package / Case :
- FBGA-96
- Packaging :
- Reel
- Series :
- MT41K
- Supply Voltage - Max :
- 1.45 V
- Supply Voltage - Min :
- 1.283 V
- Type :
- SDRAM - DDR3L
Descripción
DRAM DDR3 2G 128MX16 FBGA
Precio y Adquisiciones
Producto asociado
Usted también podría estar interesado en
| Parte | Fabricante | Existencias | Descripción |
|---|---|---|---|
| HF650P-0.0015-01-64 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| PP400-0.009-00-52 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400 |
| SP1100ST-0.012-02-63 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| HF650P-0.002-01-2 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| Q3-0.005-AC-89 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
| BP100-0.005-00-18 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| QII-0.006-AC-104 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006", 1Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II, Q2-0.006-AC-104 |
| HF650P-0.001-01-86 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SPK10-0.006-AC-2 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10 |
| SP1200-0.016-00-82 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
| PP400-0.009-AC-67 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400 |
| HF300P-0.0015-00-80 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| PP1000-0.009-00-89 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000 |
| BP100-0.005-00-113 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SP400-0.007-00-33 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400, PN0027982, IDH 2414056 |
