Descripción del producto

Número de parte
QMS-032-06.75-L-D-DP-A-GP-K
Fabricante
Samtec
categoria de producto
Conectores placa a placa y mezzanine
Descripción
Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip

Documentos y Medios

Atributos del producto

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Current Rating :
2.6 A, 4 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Packaging :
Tray
Pitch :
0.635 mm
Product :
Headers
Series :
QMS
Termination Style :
Solder Pin
Voltage Rating :
300 V

Descripción

Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip

Precio y Adquisiciones

Producto asociado

  • Xilinx
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    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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