Descripción del producto

Número de parte
BM28B0.6-44DS/2-0.35V(53)
Fabricante
Hirose Electric
categoria de producto
Conectores placa a placa y mezzanine
Descripción
Board to Board & Mezzanine Connectors

Documentos y Medios

Atributos del producto

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
200 mA, 5 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 85 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Straight
Number of Positions :
44 Position
Number of Rows :
2 Row
Packaging :
Cut Tape, Reel
Pitch :
0.35 mm
Product :
Receptacles
Stack Height :
0.6 mm
Termination Style :
Solder
Voltage Rating :
30 V

Descripción

Board to Board & Mezzanine Connectors

Precio y Adquisiciones

Producto asociado

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    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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