Descripción del producto

Número de parte
HDWM-08-55-G-S-330
Fabricante
Samtec
categoria de producto
Conectores placa a placa y mezzanine
Descripción
Board to Board & Mezzanine Connectors .050 X .100 Flex Stack, High-Temp Micro Board Stacker

Documentos y Medios

Hojas de datos
HDWM-08-55-G-S-330

Atributos del producto

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Straight
Number of Positions :
8 Position
Number of Rows :
1 Row
Packaging :
Tube
Pitch :
1.27 mm
Product :
Headers
Series :
HDWM
Stack Height :
8.382 mm
Termination Style :
Solder

Descripción

Board to Board & Mezzanine Connectors .050 X .100 Flex Stack, High-Temp Micro Board Stacker

Precio y Adquisiciones

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