Produktübersicht
- Artikelnummer
- ATS-56005-C1-R0
- Hersteller
- Advanced Thermal Solutions
- Produktkategorie
- Temperatur fällt
- Beschreibung
- Heat Sinks maxiFLOW Heat Sink , Double-Sided Thermal Tape, Black-Anodized
Dokumente & Medien
- Datenblätter
- ATS-56005-C1-R0
Produkteigenschaften
- Designed for :
- BGA
- Fin Style :
- Angled Fin
- Heatsink Material :
- Aluminum
- Height :
- 15 mm
- Length :
- 50 mm
- Mounting Style :
- Adhesive
- Product :
- Heat Sinks
- Thermal Resistance :
- 2.8 C/W
- Width :
- 45 mm
Beschreibung
Heat Sinks maxiFLOW Heat Sink , Double-Sided Thermal Tape, Black-Anodized
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
Teil | Hersteller | Lager | Beschreibung |
---|---|---|---|
AER55-55-33CB/A01 | CTS Electronic Components | 3,000 | Heat Sinks Type: Top mount / Shape: Square line fin / Length: 2.150" / Width: 2.150" / Height Off Base: 1.283" / Material: Aluminum Alloy / Material Finish: Black Anodize |
125482 | Wakefield-Vette | 3,000 | Heat Sinks 19.00" Wide x 36" Flatback Heatsink xx2016 |
500503B00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Board Level Heat Sink for TO-3, Black Anodized, 63.5x63.5x20.86mm |
530101B00100G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks High-Rise Style, Board Level, Stamped Heat Sink with Wave-On Solderable Mounts for TO-218, Twisted Fins, Vertical Mounting, 6.3 n Thermal Resistance, Black Anodized, 4.75mm Hole, 21.08mm |
342000F00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Thin-Fin, Stamped Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm |
110500F00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Grommet for TO-3 |
341700F00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Thin-Fin, Board Level Heat Sink for PCI/AGP Chip Sets, Thin Fin, Horizontal Mounting, Copper, 12.7x76.2x0.33mm |
231-69PABE-15V | Wakefield-Vette | 3,000 | Heat Sinks Compact, Stress-Free, Labor-Saving Locking-Tab Heat Sink for TO-220, Pre-Anodized Black, 17.5x12.7x10.1mm, Horizontal, 13H Tab, 15V |
533802B02500G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Board Level, Extruded Heat Sink for TO-220, Vertical Mounting, PC Pin, Black Anodized, 25.4x34.93x12.70mm |
8114LB603G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Transistor Socket for TO-3, 4 Position, Aavid Internal Part #35075 |
2321BG | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks BGA Pin Fin Extruded Heat Sink, 43.18x41.28x8.89mm |
286-CBTE | Wakefield-Vette | 3,000 | Heat Sinks Copper, Low Cost, Wave-Solderable Heat Sink for TO-220, Black, 25.4x12.7x30.2mm |
325705R00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Board Level, Extruded Heat Sink for TO-5, Cylindrical, Press Fit, Aluminum, Red Anodized, 12.70mm OD, 6.35mm Height |
PF526G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Diamond Shaped, Basket Heat Sink for TO-3, Horizontal Mounting, 8.9 n Thermal Resistance, Black Anodized, 19mm |
508322B00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Stamped Heat Sink for Dual TO-220, No Hardware Added, Black Anodized, Aavid Internal Part # 1397 |