C1812X301FFTAC7210 - KEMET Electronics

Beschreibung: Multilayer Ceramic Capacitors MLCC - SMD/SMT 1500V 300pF X8G 1812 X8G 1% Flex Term

Multilayer Ceramic Capacitors MLCC - SMD/SMT 1500V 300pF X8G 1812 X8G 1% Flex Term

XC2C256-6VQG100C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
XC2C256-6TQG144C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
XC9536XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
XC2C32A-6VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
XC9572XL-10VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44C

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
XC9572XL-10VQG64C

Xilinx

CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
XC2C64A-7VQG44I

Xilinx

CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
SPEAR300-2

STMicroelectronics

Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
XC2C512-10FT256I

STMicroelectronics

Embedded - CPLDs (Complex Programmable Logic Devices)

Teil	Hersteller	Lager	Beschreibung
CWN-SR-40	CW Industries	146	Headers & Wire Housings IDC DIP-40 STRAIN RELIEF
801-83-002-10-005101	Preci-Dip	173	Headers & Wire Housings
801-83-002-20-001101	Preci-Dip	3,288	Headers & Wire Housings
315-83-104-41-003101	Preci-Dip	1,770	Headers & Wire Housings
999-11-220-11	Preci-Dip	2,285	Headers & Wire Housings
999-11-210-10	Preci-Dip	2,470	Headers & Wire Housings
999-11-210-11	Preci-Dip	1,500	Headers & Wire Housings
999-11-220-10	Preci-Dip	1,841	Headers & Wire Housings
890-70-006-20-001101	Preci-Dip	1,992	Headers & Wire Housings
380-10-001-00-000800	Mill-Max	3,754	Headers & Wire Housings STANDARD PIN HEADER
860-10-002-10-001101	Preci-Dip	1,843	Headers & Wire Housings
802-80-004-30-480101	Preci-Dip	1,617	Headers & Wire Housings
892-70-010-10-001101	Preci-Dip	1,312	Headers & Wire Housings
801-83-003-10-012101	Preci-Dip	1,846	Headers & Wire Housings
140X10119X	CONEC	1,884	Headers & Wire Housings 40P TIN PLATED