sales@szcinty.com
Produktübersicht
- Artikelnummer
- C1812C270GCTACTU
- Hersteller
- KEMET Electronics
- Produktkategorie
- Mehrschichtige Keramikkondensatoren MLCC - SMD/SMT
- Beschreibung
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 630Vol 27pF X8G 1812 2%
Dokumente & Medien
- Datenblätter
- C1812C270GCTACTU
Produkteigenschaften
- Dielectric :
- X8G
- Maximum Operating Temperature :
- + 150 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Reel
- Series :
- SMD COMM X8G HVHT150C
- Termination :
- Standard
- Termination Style :
- SMD/SMT
Beschreibung
Multilayer Ceramic Capacitors MLCC - SMD/SMT 630Vol 27pF X8G 1812 2%
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
| Teil | Hersteller | Lager | Beschreibung |
|---|---|---|---|
| QII-0.006-AC-89 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
| SP980-0.009-00-63 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980 |
| BP100-0.005-00-86 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF625-0.005-00-94 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
| SP400-0.007-00-9 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400, BG95135, IDH 2192657 |
| PP1000-0.009-00-55 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000 |
| SP900S-0.009-00-27 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S |
| HF300P-0.001-00-93 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| HF300P-0.001-00-132 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SP1200-0.012-00-67 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.012 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
| SP1100ST-0.012-02-42 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| SP400-0.007-00-134 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
| SP1100ST-0.012-02-105 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
| SP1200-0.009-AC-131 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| QII-0.006-AC-100 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
