Produktübersicht
- Artikelnummer
- 1206B271J500CT
- Hersteller
- Walsin
- Produktkategorie
- Mehrschichtige Keramikkondensatoren MLCC - SMD/SMT
- Beschreibung
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 1206 MLCC X7R 270 pF +/- 5% 50 V T&R GP
Dokumente & Medien
- Datenblätter
- 1206B271J500CT
Produkteigenschaften
- Capacitance :
- 270 pF
- Case Code - in :
- 1206
- Case Code - mm :
- 3216
- Dielectric :
- X7R
- Height :
- 0.8 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, MouseReel, Reel
- Product :
- General Type MLCCs
- Termination :
- Standard
- Termination Style :
- SMD/SMT
- Tolerance :
- 5 %
- Voltage Rating DC :
- 50 VDC
Beschreibung
Multilayer Ceramic Capacitors MLCC - SMD/SMT 1206 MLCC X7R 270 pF +/- 5% 50 V T&R GP
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
Teil | Hersteller | Lager | Beschreibung |
---|---|---|---|
PP400-0.009-00-88 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP900/Poly-Pad 400 |
HF300P-0.001-00-10 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
SP900S-0.009-AC-96 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600S/Sil-Pad 900S |
SPK6-0.006-AC-63 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6 |
HF625-0.005-AC-30 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
SPK6-0.006-AC-62 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6 |
PP1000-0.009-00-3 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000 |
SP1200-0.009-00-76 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
BP100-0.011-00-8 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
SPK10-0.006-00-111 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1300/Sil-Pad K-10 |
SP1200-0.009-00-96 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
SPK4-0.006-AC-4 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4 |
SPK4-0.006-AC-59 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K900/Sil-Pad K-4 |
PPK4-0.006-00-41 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
SP1200-0.009-00-53 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |