Produktübersicht

Artikelnummer
C324C242KAG5TA
Hersteller
KEMET Electronics
Produktkategorie
Vielschicht-Keramikkondensatoren MLCC - bedrahtet
Beschreibung
Multilayer Ceramic Capacitors MLCC - Leaded 250V 2400pF C0G 10% LS=2.54mm

Dokumente & Medien

Datenblätter
C324C242KAG5TA

Produkteigenschaften

Capacitance :
2400 pF
Case Style :
Conformally Coated
Dielectric :
C0G (NP0)
Height :
5.84 mm
Lead Spacing :
2.54 mm
Length :
5.08 mm
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Packaging :
Bulk
Product :
General Type MLCCs
Series :
GoldMax 300 Comm C0G
Termination Style :
Radial
Tolerance :
10 %
Voltage Rating DC :
250 VDC
Width :
3.18 mm

Beschreibung

Multilayer Ceramic Capacitors MLCC - Leaded 250V 2400pF C0G 10% LS=2.54mm

Preis & Beschaffung

Zugehöriges Produkt

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Das könnte Sie auch interessieren

Teil Hersteller Lager Beschreibung
SPK6-0.006-AC-116 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6
Q3-0.005-00-23 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP Q2000/aka Q-Pad 3
PP400-0.009-AC-117 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400
PP1000-0.009-AC-24 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000
QII-0.006-AC-8 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II
PP400-0.009-AC-103 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400
SP1100ST-0.012-02-32 Bergquist Company 3,000 Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST
HF625-0.005-AC-138 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625
SP800-0.005-00-125 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800
HF625-0.005-AC-47 Bergquist Company 3,000 Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625
HF650P-0.0015-01-116 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
HF300P-0.0015-00-34 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
SP1100ST-0.012-02-62 Bergquist Company 3,000 Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST
BP100-0.008-00-64 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SP1500ST-0.008-02-61 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST