sales@szcinty.com
Produktübersicht
- Artikelnummer
- MFS1/2DCT52R1212F
- Hersteller
- KOA Speer
- Produktkategorie
- Metallschichtwiderstände
- Beschreibung
- Metal Film Resistors - Through Hole 12.1K ohm OHM 1%
Dokumente & Medien
- Datenblätter
- MFS1/2DCT52R1212F
Produkteigenschaften
- Diameter :
- 2.3 mm
- Length :
- 7.1 mm
- Maximum Operating Temperature :
- + 155 C
- Minimum Operating Temperature :
- - 55 C
- Packaging :
- Cut Tape, Reel
- Power Rating :
- 500 mW (1/2 W)
- Product :
- Metal Film Resistors General Purpose
- Qualification :
- AEC-Q200
- Resistance :
- 12.1 kOhms
- Series :
- MFS
- Temperature Coefficient :
- 100 PPM / C
- Termination Style :
- Axial
- Tolerance :
- 1 %
- Type :
- Semi-Precision Metal Film Leaded Resistor
Beschreibung
Metal Film Resistors - Through Hole 12.1K ohm OHM 1%
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
| Teil | Hersteller | Lager | Beschreibung |
|---|---|---|---|
| BP100-0.005-00-4 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF300P-0.002-00-96 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| BP100-0.005-00-17 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SP1500ST-0.008-02-56 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST |
| PPK4-0.006-AC-67 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| PPK4-0.006-00-46 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| BP100-0.008-00-122 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| BP100-0.005-00-6 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| SPK4-0.006-00-46 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| SP800-0.005-AC-2 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
| SPK6-0.006-AC-70 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6 |
| HF300P-0.001-00-99 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| BP100-0.005-00-92 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF300P-0.002-00-53 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SP400-0.009-AC-32 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
