Produktübersicht

Artikelnummer
DSC1001BI2-013.0810
Hersteller
Microchip Technology
Produktkategorie
Standard-Clock-Oszillatoren
Beschreibung
Standard Clock Oscillators MEMS Oscillator Low Power,-40 to 85C,25ppm

Dokumente & Medien

Datenblätter
DSC1001BI2-013.0810

Produkteigenschaften

Frequency :
13.081 MHz
Frequency Stability :
25 PPM
Height :
0.85 mm
Length :
5 mm
Load Capacitance :
40 pF
Maximum Operating Temperature :
+ 85 C
Minimum Operating Temperature :
- 40 C
Operating Supply Voltage :
1.8 V to 3.3 V
Output Format :
CMOS
Package / Case :
CDFN-4
Packaging :
Tube
Product Type :
MEMS Clock Oscillators
Series :
DSC1001
Supply Voltage - Max :
3.3 V
Supply Voltage - Min :
1.8 V
Termination Style :
SMD/SMT
Width :
3.2 mm

Beschreibung

Standard Clock Oscillators MEMS Oscillator Low Power,-40 to 85C,25ppm

Preis & Beschaffung

Zugehöriges Produkt

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Das könnte Sie auch interessieren

Teil Hersteller Lager Beschreibung
SPA1500-0.010-00-104 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500
SP1200-0.016-00-26 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.016 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200
SPK6-0.006-AC-123 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6
SPA1500-0.010-AC-94 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, 1 Side Adhesive, Sil-Pad TSP A2000/Sil-Pad A1500
BP100-0.011-00-15 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SP1500ST-0.008-02-81 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.008 Inch Thick, Sil-Pad TSP 1800ST/Sil-Pad 1500ST
SP1200-0.009-AC-99 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200
SP2000-0.010-00-51 Bergquist Company 3,000 Thermal Interface Products High Reliability Insulator, 0.010 Inch Thick, Sil-Pad TSP 3500/Sil-Pad 2000
SPK6-0.006-00-101 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6
SP2000-0.010-AC-120 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 3500/Sil-Pad 2000
SP980-0.009-AC-32 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980
SP2000-0.010-00-133 Bergquist Company 3,000 Thermal Interface Products High Reliability Insulator, 0.010 Inch Thick, Sil-Pad TSP 3500/Sil-Pad 2000
SP2000-0.010-00-46 Bergquist Company 3,000 Thermal Interface Products High Reliability Insulator, 0.010 Inch Thick, Sil-Pad TSP 3500/Sil-Pad 2000
BP100-0.011-00-2 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
BP100-0.011-00-7 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100