sales@szcinty.com
Produktübersicht
- Artikelnummer
- WSLP08055L000FEK18
- Hersteller
- Vishay / Dale
- Produktkategorie
- Strommesswiderstände - SMD
- Beschreibung
- Current Sense Resistors - SMD 1watt 0.005ohm 1%
Dokumente & Medien
- Datenblätter
- WSLP08055L000FEK18
Produkteigenschaften
- Case Code - in :
- 0805
- Case Code - mm :
- 2012
- Maximum Operating Temperature :
- + 170 C
- Minimum Operating Temperature :
- - 65 C
- Packaging :
- Bulk
- Power Rating :
- 1 W
- Resistance :
- 5 mOhms
- Series :
- WSLP-18
- Technology :
- Metal Strip
- Temperature Coefficient :
- 110 PPM / C
- Termination :
- 2 Terminal
- Termination Style :
- SMD/SMT
- Tolerance :
- 1 %
Beschreibung
Current Sense Resistors - SMD 1watt 0.005ohm 1%
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
| Teil | Hersteller | Lager | Beschreibung |
|---|---|---|---|
| 30721 | Vicor | 5 | Heat Sinks XF 10.16MM CFG B |
| 1960091939T001 | Advantech | 7 | Heat Sinks VEGA 320 Standard heatsink |
| conga-MA5/CSP-T | congatec | 2 | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. |
| conga-QA5/i-CSP-T | congatec | 2 | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. |
| conga-QA5/CSP-T | congatec | 3 | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. |
| conga-MA5/i-CSP-T | congatec | 2 | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. |
| conga-MA5/CSP-B | congatec | 1 | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. |
| conga-MA5/i-CSP-B | congatec | 4 | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. |
| conga-SA5/i-CSP-B | congatec | 12 | Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. |
| conga-QA3/HSP-B | congatec | 32 | Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm |
| RM-N8 heatsink | iBASE Technology | 2 | Heat Sinks HEATSINK;RM-N8 |
| 38146 | Vicor | 3 | Heat Sinks HEATSINK VIBRICK1.25 |
| conga-QA3/CSP-T | congatec | 26 | Heat Sinks Passive cooling solution for Qseven modules conga-QA3, QA3E and QA4. All standoffs are M2.5mm thread. |
| conga-MA3/CSP-T | congatec | 2 | Heat Sinks Standard passive cooling solution for COM Express Type 10 modules conga-MA3 and MA3E with fins. All standoffs are M2.5mm thread. |
| conga-QA3/CSP-B | congatec | 2 | Heat Sinks Passive cooling solution for Qseven modules conga-QA3, QA3E and QA4. All standoffs are with 2.7mm bore hole. |
