Produktübersicht
- Artikelnummer
- PIC24FJ64GA002-E/SS
- Hersteller
- Microchip Technology
- Produktkategorie
- 16-Bit-Mikrocontroller - MCU
- Beschreibung
- 16-bit Microcontrollers - MCU 16B 64KB Flash I/O 16 MIPS nanoWatt
Dokumente & Medien
- Datenblätter
- PIC24FJ64GA002-E/SS
Produkteigenschaften
- ADC Resolution :
- 10 bit
- Core :
- PIC24F
- Data Bus Width :
- 16 bit
- Data RAM Size :
- 8 kB
- Maximum Clock Frequency :
- 32 MHz
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- SMD/SMT
- Number of I/Os :
- 21 I/O
- Operating Supply Voltage :
- 2 V to 3.6 V
- Package / Case :
- SSOP-28
- Packaging :
- Tube
- Program Memory Size :
- 64 kB
- Qualification :
- AEC-Q100
- Series :
- PIC24FJxxGA00x
Beschreibung
16-bit Microcontrollers - MCU 16B 64KB Flash I/O 16 MIPS nanoWatt
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
Teil | Hersteller | Lager | Beschreibung |
---|---|---|---|
HS301DR | Crydom / Sensata | 20 | Heat Sinks 3.0 C/W DIN RM Heat Sink - 1 SSR |
HS122 | Crydom / Sensata | 29 | Heat Sinks 1.2 C/W PM Heat Sink 1 2 SSR's |
HS201 | Crydom / Sensata | 26 | Heat Sinks 2.0 C/W PM Heat Sink 1 SSR |
HS073 | Crydom / Sensata | 10 | Heat Sinks ALUMINUM HEATSINK |
HS151 | Crydom / Sensata | 8 | Heat Sinks 1.5 C/W PM Heat Sink 1 SSR |
APA501-80-001 | Artesyn Embedded Technologies | 59 | Heat Sinks Heatsink vertical fins 0.6" ht. |
SW38-4 | Aavid, Thermal Division of Boyd Corporation | 500 | Heat Sinks Extruded Style Heat Sink for TO-218, Unequal Channel Widths, Vertical Mounting with Holes, 10.2 n Thermal Resistance, Black Anodized, 3.00mm Hole, 38mm |
1.25GY-50 | Aavid, Thermal Division of Boyd Corporation | 500 | Heat Sinks Extruded Style Heat Sink for TO-220, Horizontal/Vertical Mounting, 6.8/8.8 Degree C/W Thermal Resistance |
PF720 | Aavid, Thermal Division of Boyd Corporation | 2,000 | Heat Sinks Slide-On Style Heat Sink for TO-220, Vertical Mounting, 28.9 n Thermal Resistance, No Solderable Tabs |
APA502-80-001 | Artesyn Embedded Technologies | 47 | Heat Sinks PAD THERMAL SIZE80 FOR AMPSS MOD |
HS-QB100-UVQ-C | Murata Power Solutions | 44 | Heat Sinks heat sink |
APA501-80-003 | Artesyn Embedded Technologies | 100 | Heat Sinks 115x 59 x22.5mm VERT |
DV-T268-101E-TR | Ohmite | 2,250 | Heat Sinks HEATSINK FOR TO-268 DEGREASED |
CR401-25VE | Ohmite | 88 | Heat Sinks Aluminum heatsink 25mmdegreased |
CR301-75VE | Ohmite | 20 | Heat Sinks Aluminum heatsink 75mmdegreased |