Produktübersicht
- Artikelnummer
- C0805X309CCTACAUTO7210
- Hersteller
- KEMET Electronics
- Produktkategorie
- Mehrschichtige Keramikkondensatoren MLCC - SMD/SMT
- Beschreibung
- Multilayer Ceramic Capacitors MLCC - SMD/SMT 500Volt 3pF X8G 0805 0.25 pF Flex AECQ2
Dokumente & Medien
- Datenblätter
- C0805X309CCTACAUTO7210
Produkteigenschaften
- Packaging :
- Reel
- Series :
- SMD AUTO X8G HVHT150C FLEX
Beschreibung
Multilayer Ceramic Capacitors MLCC - SMD/SMT 500Volt 3pF X8G 0805 0.25 pF Flex AECQ2
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
Teil | Hersteller | Lager | Beschreibung |
---|---|---|---|
Q3-0.005-AC-95 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2000/Q-Pad 3 |
SP800-0.005-AC-86 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
QII-0.006-AC-95 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP Q2500/Q-Pad II |
PP1000-0.009-AC-116 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP1200/Poly-Pad 1000 |
SPK6-0.006-AC-102 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6 |
HF650P-0.002-01-60 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
PP1000-0.009-00-133 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000 |
SP400-0.007-AC-18 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 900/Sil-Pad 400 |
SP800-0.005-AC-87 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
SP800-0.005-AC-18 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1600/Sil-Pad 800 |
HF300P-0.001-00-129 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
SP980-0.009-00-61 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980 |
SPK6-0.006-00-77 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |
PPK4-0.006-AC-25 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PPK900/Poly-Pad K-4 |
SPK6-0.006-00-90 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1100/Sil-Pad K-6 |