sales@szcinty.com
Produktübersicht
- Artikelnummer
- 70RXA510M18X20
- Hersteller
- Rubycon
- Produktkategorie
- Aluminium-Elektrolytkondensatoren - radial bedrahtet
- Beschreibung
- Aluminum Electrolytic Capacitors - Radial Leaded AUTOMOTIVE HIGH TEMPERATURE CAPACITORS
Dokumente & Medien
- Datenblätter
- 70RXA510M18X20
Produkteigenschaften
- Capacitance :
- 510 uF
- Diameter :
- 18 mm
- ESR :
- 61 mOhms
- Lead Spacing :
- 7.5 mm
- Lead Style :
- Cut
- Length :
- 20 mm
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 40 C
- Product :
- General Purpose Electrolytic Capacitors
- Series :
- RXA
- Termination Style :
- Radial
- Tolerance :
- 20 %
- Voltage Rating DC :
- 70 VDC
Beschreibung
Aluminum Electrolytic Capacitors - Radial Leaded AUTOMOTIVE HIGH TEMPERATURE CAPACITORS
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
| Teil | Hersteller | Lager | Beschreibung |
|---|---|---|---|
| W25M512JWEIM | Winbond | 3,000 | Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR |
| S71KL512SC0BHB000 | Cypress Semiconductor | 3,000 | Multichip Packages Nor |
| S71KS512SC0BHB003 | Cypress Semiconductor | 3,000 | Multichip Packages Nor |
| MT29AZ5A3CHHTB-18AIT.109 | Micron | 3,000 | Multichip Packages MASSFLASH/LPDDR2 6G |
| MT29GZ5A5BPGGA-046IT.87J | Micron | 3,000 | Multichip Packages NAND MCP 8G VFBGA |
| S71KL512SC0BHB003 | Cypress Semiconductor | 3,000 | Multichip Packages Nor |
| MT29AZ5A3CHHTB-18AAT.109 | Micron | 3,000 | Multichip Packages MASSFLASH/LPDDR2 6G |
| S71KL512SC0BHV003 | Cypress Semiconductor | 3,000 | Multichip Packages Nor |
| W71NW11GC1HW | Winbond | 3,000 | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x32 |
| W25M02GVTCIT | Winbond | 3,000 | Multichip Packages 2G-bit Serial NAND flash, 3V |
| W25M512JVBIM | Winbond | 3,000 | Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR |
| W25M512JVCIQ | Winbond | 3,000 | Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector |
| W25M512JVCIM | Winbond | 3,000 | Multichip Packages spiFlash, 3V, 512M-bit, 4Kb Uniform Sector, DTR |
| W25M512JWCIM | Winbond | 3,000 | Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, DTR |
| W25M512JWCIQ | Winbond | 3,000 | Multichip Packages spiFlash, 1.8V, 512M-bit, 4Kb Uniform Sector, |
