Produktübersicht

Artikelnummer
2-87456-3
Hersteller
TE Connectivity
Produktkategorie
Stiftleisten und Kabelgehäuse
Beschreibung
Headers & Wire Housings 28 MODIV HSG COMP DR

Dokumente & Medien

Datenblätter
2-87456-3

Produkteigenschaften

Application :
Wire-to-Board
Contact Gender :
-
Contact Plating :
-
Mating Post Length :
-
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 65 C
Mounting Angle :
-
Mounting Style :
-
Number of Positions :
28 Position
Number of Rows :
2 Row
Pitch :
2.54 mm
Product :
Wire Housings
Row Spacing :
2.54 mm
Series :
AMPMODU MOD IV
Termination Post Length :
-
Termination Style :
-
Tradename :
AMPMODU
Type :
Receptacle Housing
Wire Gauge :
-

Beschreibung

Headers & Wire Housings 28 MODIV HSG COMP DR

Preis & Beschaffung

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