Produktübersicht

Artikelnummer
KJA6T17F35SNL27
Hersteller
ITT Cannon
Produktkategorie
Rundsteckverbinder nach MIL-Spezifikation
Beschreibung
Circular MIL Spec Connector

Dokumente & Medien

Datenblätter
KJA6T17F35SNL27

Produkteigenschaften

Series :
KJ

Beschreibung

Circular MIL Spec Connector

Preis & Beschaffung

Zugehöriges Produkt

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Das könnte Sie auch interessieren

Teil Hersteller Lager Beschreibung
A18053-12 Laird Performance Materials 3,000 Thermal Interface Products TFLEX 3120TG
SF500G-707005 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity
SF500-313005 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
A17682-014 Laird Performance Materials 3,000 Thermal Interface Products Tflex UT20350 9 x 9
SF500-202005 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
A15346-01 Laird Performance Materials 3,000 Thermal Interface Products Tflex 360H 9" x 9"
SF500-301205 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
A15339-01 Laird Performance Materials 3,000 Thermal Interface Products Tflex 3190 9x9" 1.2W/mK
AF200-153005 CUI Devices 3,000 Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 2.0 W/m*K Thermal Conductivity
XPC100A003-01-B Lantronix 3,000 Thermal Interface Products xPico Thermal Pad L2 5mm bulk pack
QB1020A40ESS3 ATC / Kyocera AVX 3,000 Thermal Interface Products 1020 40mm AlN No Wrap
QB2525A60ESS3 ATC / Kyocera AVX 3,000 Thermal Interface Products 2525 60mm AlN No Wrap
A15959-07 Laird Performance Materials 3,000 Thermal Interface Products T-flex HR480 9" X 9" X 0.080"
A17932-18 Laird Performance Materials 3,000 Thermal Interface Products TFLEX B2180FG
A17928-18 Laird Performance Materials 3,000 Thermal Interface Products TFLEX B2180MFG