sales@szcinty.com
Produktübersicht
- Artikelnummer
- 831-83-013-40-001101
- Hersteller
- Preci-Dip
- Produktkategorie
- Stiftleisten und Kabelgehäuse
- Beschreibung
- Headers & Wire Housings
Dokumente & Medien
- Datenblätter
- 831-83-013-40-001101
Beschreibung
Headers & Wire Housings
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
| Teil | Hersteller | Lager | Beschreibung |
|---|---|---|---|
| TS006-CEM500 | Axiomtek | 3,000 | Heat Sinks CEM500 Heatspreader |
| TS003-CEM880 | Axiomtek | 3,000 | Heat Sinks High profile Heatsink w/o fan |
| THSF-IBR-BTL-CU | ADLINK Technology | 3,000 | Heat Sinks HEAT SINK w/ FAN FOR Express-IBR |
| 5023NG | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Card Ejectors, 27.05x6.35x16.51mm |
| 573902B00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Board Level, Stamped Heat Sink for TO-220, Vertical Mounting, Black Anodized, 12.7x14.48x38.1mm, No Hardware, Clip-On |
| 642-45ABT4E | Wakefield-Vette | 3,000 | Heat Sinks Unidirectional Fin Heat Sink for 35mm BGA, 35x11.4mm, Chomerics T410R |
| 527-45AB-T725 | Wakefield-Vette | 3,000 | Heat Sinks Heat Sink for DC/DC Converters, Half Brick, 57.9x61x11.4mm, Horizontal, 11 Fins, Chomerics T725 |
| MV-101-27E | Ohmite | 3,000 | Heat Sinks HTSNK TO-247,TO-266 DEGREASED |
| 512-3M | Wakefield-Vette | 3,000 | Heat Sinks High Fin Density Heat Sinks for Power Modules, IGBTs & Relays |
| 130-E | Wakefield-Vette | 3,000 | Heat Sinks Compression Clamp Assemblies for Semiconductors to 2.25 in. |
| 139-3F | Wakefield-Vette | 3,000 | Heat Sinks Compression Clamp Assemblies for Semicondutors to 3.50in. |
| HSE-B20381-035H-02 | CUI Devices | 3,000 | Heat Sinks 38.1x25x12.7mm w/pin extrusion TO-220 |
| HSE-B20508-035H-01 | CUI Devices | 3,000 | Heat Sinks 50.8x25x12.7mm w/pin extrusion TO-220 |
| SCM120 heat sink | Axiomtek | 3,000 | Heat Sinks |
| AmITX-SL/HL TM-HS | ADLINK Technology | 3,000 | Heat Sinks Chipset Heatsink 27.8x25x27.8mm Incl. in 91-7A101-**** |
