Produktübersicht

Artikelnummer
D38999/20FC98BD
Hersteller
Amphenol Aerospace
Produktkategorie
Rundsteckverbinder nach MIL-Spezifikation
Beschreibung
Circular MIL Spec Connector TV 10C 10#20 SKT RECP

Dokumente & Medien

Datenblätter
D38999/20FC98BD

Produkteigenschaften

Contact Gender :
Without Socket Contacts
Current Rating :
7.5 A
Insert Arrangement :
13-98
MIL Type :
MIL-DTL-38999 III
Mounting Style :
Panel
Number of Positions :
10 Position
Product :
Receptacles
Series :
D38999 III
Shell Size :
13
Shell Style :
Wall Mount
Termination Style :
Crimp

Beschreibung

Circular MIL Spec Connector TV 10C 10#20 SKT RECP

Preis & Beschaffung

Zugehöriges Produkt

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Das könnte Sie auch interessieren

Teil Hersteller Lager Beschreibung
SPA1500-0.010-00-63 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500
SP980-0.009-00-27 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
SPK6-0.006-AC-84 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1100/Sil-Pad K-6
SP980-0.009-00-26 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1680/Sil-Pad 980
SPA1500-0.010-00-62 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500
HF650P-0.002-01-24 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P
SPK10-0.006-00-82 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K1300/Sil-Pad K-10
BP100-0.011-00-75 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SP900S-0.009-00-81 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1600S/Sil-Pad 900S
SP980-0.009-AC-117 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980
BP100-0.011-00-33 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 0.011 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
SP1200-0.012-AC-21 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.012 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200
HF300P-0.002-00-135 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
HF300P-0.002-00-67 Bergquist Company 3,000 Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P
SP980-0.009-AC-105 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980