Produktübersicht

Artikelnummer
D3899924FF11BD
Hersteller
SOURIAU
Produktkategorie
Rundsteckverbinder nach MIL-Spezifikation
Beschreibung
Circular MIL Spec Connector

Dokumente & Medien

Datenblätter
D3899924FF11BD

Produkteigenschaften

Contact Gender :
Without Socket Contacts
Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
10 A
Insert Arrangement :
19-11
MIL Type :
MIL-DTL-38999 III
Mounting Style :
Free Hanging
Number of Positions :
11 Position
Product :
Receptacles
Shell Size :
19
Shell Style :
Jam Nut

Beschreibung

Circular MIL Spec Connector

Preis & Beschaffung

Zugehöriges Produkt

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Das könnte Sie auch interessieren

Teil Hersteller Lager Beschreibung
GF2000-00-15-1200CC Bergquist Company 3,000 Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 2000/Gap Filler 2000
2165794 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009" Thick, Dimensions: 1.65x1.14", Sil-Pad TSP 1600S/Sil-Pad 900S
GPVO-0.200-01-0816 Bergquist Company 3,000 Thermal Interface Products GAP PAD, Conformable, 8x16" Sheet, 0.200" Thick, GAP PAD TGP 800VO/GAP PAD VO
2192720 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.007" Thick, Dimensions: 1.000x1.000 Inch, Sil-Pad TSP 900/Sil-Pad 400
SoftFlex-A014-20-01-0762-0762 Aavid, Thermal Division of Boyd Corporation 3,000 Thermal Interface Products SoftFlex Pad, 1.4 Thermal Conductivity, 2mm Thickness, Single-Sided Adhesive, 76.2x76.2mm
SoftFlex-C022-20-01-0762-0762 Aavid, Thermal Division of Boyd Corporation 3,000 Thermal Interface Products SoftFlex Pad, 2.2 Thermal Conductivity, 2mm Thickness, Single-Sided Adhesive, 76.2x76.2mm
BP100-0.008-00-1112 Bergquist Company 3,000 Thermal Interface Products Adhesive Tape, 11x12 Inch Sheet, 0.008 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100
2167577 Bergquist Company 3,000 Thermal Interface Products GAP PAD, 0.394x1.89 Inch, GAP PAD TGP 2400/GAP PAD 2500S20
GPVO-0.100-AC-0816 Bergquist Company 3,000 Thermal Interface Products GAP PAD, 8x16" Sheet, 0.100" Thick, 1Side Adhesive, GAP PAD TGP 800VO/GAP PAD VO
GPVOUS-B-0.060-01-0816 Bergquist Company 3,000 Thermal Interface Products GAP PAD, 8x16" Sheet, 0.06" Thick, GAP PAD TGP 1000VOUSB/GAP PAD VO Ultra Soft-B
GF1500-07-60-1200CC Bergquist Company 3,000 Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 1500/Gap Filler 1500, IDH 2167147
GF1500-07-480-1200CC Bergquist Company 3,000 Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 1500/Gap Filler 1500
GF1500-10-60-1200CC Bergquist Company 3,000 Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 1500/Gap Filler 1500, IDH 2167472
SP400-0.009-00-2 Bergquist Company 3,000 Thermal Interface Products Sil-Pad, 0.009" Thick, 1Side Adhesive, 1.78x1.25", Sil-Pad TSP 900/Sil-Pad 400
SoftFlex-D021-20-01-0762-0762 Aavid, Thermal Division of Boyd Corporation 3,000 Thermal Interface Products SoftFlex Pad, 2.1 Thermal Conductivity, 2mm Thickness, Single-Sided Adhesive, 76.2x76.2mm