Produktübersicht
- Artikelnummer
- TFSD-10-28-G-30.00-T-NDS
- Hersteller
- Samtec
- Produktkategorie
- Rechteckige Kabelkonfektionen
- Beschreibung
- Rectangular Cable Assemblies .050 Tiger Eye Double Row Discrete Wire Cable Assembly, Terminal
Dokumente & Medien
- Datenblätter
- TFSD-10-28-G-30.00-T-NDS
Produkteigenschaften
- Packaging :
- Bulk
- Product :
- Discrete Wire Cable Assemblies
Beschreibung
Rectangular Cable Assemblies .050 Tiger Eye Double Row Discrete Wire Cable Assembly, Terminal
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
Teil | Hersteller | Lager | Beschreibung |
---|---|---|---|
W71NW10GE3FW | Winbond | 3,000 | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32 |
W71NW11GBADW | Winbond | 3,000 | Multichip Packages 1G-bit 1.8V NAND + 256Mb LPDDR1 MCP x16/x16 |
W25M161AVEIT TR | Winbond | 3,000 | Multichip Packages 1Gb Serial NAND flash 3V + 16Mb Serial Flash 3V MCP |
MT29GZ5A3BPGGA-046IT.87K | Micron | 3,000 | Multichip Packages NAND MCP 6G |
MT29C4G48MAYBBAKS-48 IT TR | Micron | 3,000 | Multichip Packages MASSFLASH/MOBILE DDR 6G |
MT29C4G48MAYBBAMR-48 IT TR | Micron | 3,000 | Multichip Packages MASSFLASH/MOBILE DDR 6G |
MT29C1G12MAAJVAMD-5 IT | Micron | 3,000 | Multichip Packages MASSFLASH/MOBILE DDR 1.5G |
MT29GZ5A3BPGGA-53AIT.87K | Micron | 3,000 | Multichip Packages MASSFLASH/LPDDR4 6G |
MT29GZ5A3BPGGA-046AIT.87K | Micron | 3,000 | Multichip Packages NAND MCP 6G |
W25M321AVEIT TR | Winbond | 3,000 | Multichip Packages 1Gb Serial NAND flash 3V + 32Mb Serial Flash 3V MCP |
W71NW10GF3FW | Winbond | 3,000 | Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x8/x32 |
W71NW11GC1DW | Winbond | 3,000 | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16 |
W71NW11HC1DW | Winbond | 3,000 | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16 |
W25M161AWEIT TR | Winbond | 3,000 | Multichip Packages 1Gb Serial NAND flash 1.8V + 16Mb Serial Flash 1.8V MCP |
MT29GZ5A3BPGGA-046AAT.87K | Micron | 3,000 | Multichip Packages NAND MCP 6G |