sales@szcinty.com
Produktübersicht
- Artikelnummer
- TMM-103-06-LM-S-SM-P
- Hersteller
- Samtec
- Produktkategorie
- Stiftleisten und Kabelgehäuse
- Beschreibung
- Headers & Wire Housings Low Profile Tiger Eye Header Strips, 2.00 mm Pitch
Dokumente & Medien
- Datenblätter
- TMM-103-06-LM-S-SM-P
Produkteigenschaften
- Mounting Style :
- SMD/SMT
- Packaging :
- Tube
- Series :
- TMM
- Tradename :
- FleXYZ
Beschreibung
Headers & Wire Housings Low Profile Tiger Eye Header Strips, 2.00 mm Pitch
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
| Teil | Hersteller | Lager | Beschreibung |
|---|---|---|---|
| HTS-BD7-BT | ADLINK Technology | 3,000 | Heat Sinks Heatspreader for Express-BD7 with through hole standoffs for top mounting |
| TS004-CEM880 | Axiomtek | 3,000 | Heat Sinks |
| conga-TR4/HSP-HP-B | congatec | 3,000 | Heat Sinks Standard heatspreader for high performance COM Express module conga-TR4 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| THSF-HR-BL | ADLINK Technology | 3,000 | Heat Sinks H/P HEAT SINK w/ FAN FOR Express-HR |
| THSH-SL2-BL | ADLINK Technology | 3,000 | Heat Sinks High profile heatsink for Express-SL2/KL2 with threaded standoffs for bottom mounting |
| TS006-CEM500 | Axiomtek | 3,000 | Heat Sinks CEM500 Heatspreader |
| TS003-CEM880 | Axiomtek | 3,000 | Heat Sinks High profile Heatsink w/o fan |
| THSF-IBR-BTL-CU | ADLINK Technology | 3,000 | Heat Sinks HEAT SINK w/ FAN FOR Express-IBR |
| 5023NG | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Card Ejectors, 27.05x6.35x16.51mm |
| 573902B00000G | Aavid, Thermal Division of Boyd Corporation | 3,000 | Heat Sinks Board Level, Stamped Heat Sink for TO-220, Vertical Mounting, Black Anodized, 12.7x14.48x38.1mm, No Hardware, Clip-On |
| 642-45ABT4E | Wakefield-Vette | 3,000 | Heat Sinks Unidirectional Fin Heat Sink for 35mm BGA, 35x11.4mm, Chomerics T410R |
| 527-45AB-T725 | Wakefield-Vette | 3,000 | Heat Sinks Heat Sink for DC/DC Converters, Half Brick, 57.9x61x11.4mm, Horizontal, 11 Fins, Chomerics T725 |
| MV-101-27E | Ohmite | 3,000 | Heat Sinks HTSNK TO-247,TO-266 DEGREASED |
| 512-3M | Wakefield-Vette | 3,000 | Heat Sinks High Fin Density Heat Sinks for Power Modules, IGBTs & Relays |
| 130-E | Wakefield-Vette | 3,000 | Heat Sinks Compression Clamp Assemblies for Semiconductors to 2.25 in. |
