Produktübersicht
- Artikelnummer
- MPXC2011DT1
- Hersteller
- NXP Semiconductors
- Produktkategorie
- Drucksensoren für Platinenmontage
- Beschreibung
- Board Mount Pressure Sensors CHIP PAK 1/3 GEL FILL
Dokumente & Medien
- Datenblätter
- MPXC2011DT1
Produkteigenschaften
- Accuracy :
- 1 %
- Interface Type :
- -
- Maximum Operating Temperature :
- + 40 C
- Minimum Operating Temperature :
- + 15 C
- Mounting Style :
- Through Hole
- Operating Pressure :
- 0 Pa to 10 kPa
- Operating Supply Voltage :
- 3 V
- Output Type :
- Analog
- Package / Case :
- Case 423A-03
- Packaging :
- Cut Tape, Reel
- Port Type :
- No Port
- Pressure Type :
- Gauge
- Resolution :
- -
- Series :
- MPXC201xDT1
Beschreibung
Board Mount Pressure Sensors CHIP PAK 1/3 GEL FILL
Preis & Beschaffung
Zugehöriges Produkt
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