Produktübersicht
- Artikelnummer
- 43650-0809
- Hersteller
- Molex
- Produktkategorie
- Stiftleisten und Kabelgehäuse
- Beschreibung
- Headers & Wire Housings 3MM MICRO-FIT RA 8 CKT Tin
Dokumente & Medien
- Datenblätter
- 43650-0809
Produkteigenschaften
- Application :
- Power, Wire-to-Board
- Contact Gender :
- Pin (Male)
- Contact Plating :
- Tin
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Right Angle
- Mounting Style :
- SMD/SMT
- Number of Positions :
- 8 Position
- Number of Rows :
- 1 Row
- Packaging :
- Cut Tape, MouseReel, Reel
- Pitch :
- 3 mm
- Product :
- Headers
- Series :
- 43650
- Termination Style :
- Solder
- Tradename :
- Micro-Fit 3.0
- Type :
- Shrouded
Beschreibung
Headers & Wire Housings 3MM MICRO-FIT RA 8 CKT Tin
Preis & Beschaffung
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