sales@szcinty.com
Produktübersicht
- Artikelnummer
- SEAM-50-09.0-L-08-2-A-K-TR
- Hersteller
- Samtec
- Produktkategorie
- Board-to-Board- und Mezzanine-Steckverbinder
- Beschreibung
- Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Dokumente & Medien
- Datenblätter
- SEAM-50-09.0-L-08-2-A-K-TR
Produkteigenschaften
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 2.7 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 400 Position
- Number of Rows :
- 8 Row
- Packaging :
- Reel
- Pitch :
- 1.27 mm
- Product :
- Connectors
- Series :
- SEAM
- Stack Height :
- 7 mm
- Termination Style :
- Solder
- Voltage Rating :
- 240 VAC
Beschreibung
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
| Teil | Hersteller | Lager | Beschreibung |
|---|---|---|---|
| SP1200-0.012-00-61 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.012 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
| PPK4-0.006-00-91 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| SP980-0.009-AC-124 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1680/Sil-Pad 980 |
| PPK10-0.006-00-75 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK1300/Poly-Pad K-10 |
| HF650P-0.0015-01-123 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.0015 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| BP100-0.005-00-94 | Bergquist Company | 3,000 | Thermal Interface Products Adhesive Tape, 0.005 Inch Thick, Bond-Ply TBP 850/Bond-Ply 100 |
| HF300P-0.002-00-37 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
| SP1200-0.016-AC-27 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, 1 Side Adhesive, Sil-Pad TSP 1800/Sil-Pad 1200 |
| PPK4-0.006-00-85 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK900/Poly-Pad K-4 |
| SPK4-0.006-00-91 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| HF650P-0.002-01-45 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.002 Inch Thick, Hi-Flow THF 1500P/aka Hi-Flow 650P |
| SPK4-0.006-00-92 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
| SPK10-0.006-AC-8 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, 1 Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10 |
| SP1200-0.016-00-112 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.016 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
| PPK10-0.006-00-33 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK1300/Poly-Pad K-10 |
