Produktübersicht

Artikelnummer
FBBF050V02C13
Hersteller
Amphenol Commercial
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors FLTStack 0.5mm, F2, V/T, DIP, 30U" Gold

Dokumente & Medien

Datenblätter
FBBF050V02C13

Produkteigenschaften

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
500 mA
Housing Material :
Thermoplastic (TP)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Vertical
Number of Positions :
50 Position
Number of Rows :
2 Row
Packaging :
Reel
Pitch :
0.5 mm
Product :
Receptacles
Series :
FLTStack 0.50mm
Termination Style :
Solder

Beschreibung

Board to Board & Mezzanine Connectors FLTStack 0.5mm, F2, V/T, DIP, 30U" Gold

Preis & Beschaffung

Zugehöriges Produkt

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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