Produktübersicht
- Artikelnummer
- TW-18-06-G-5-433-090
- Hersteller
- Samtec
- Produktkategorie
- Board-to-Board- und Mezzanine-Steckverbinder
- Beschreibung
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Dokumente & Medien
- Datenblätter
- TW-18-06-G-5-433-090
Produkteigenschaften
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 5.2 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 90 Position
- Number of Rows :
- 5 Row
- Packaging :
- Bulk
- Pitch :
- 2 mm
- Product :
- Connectors
- Series :
- TW
- Stack Height :
- 4.06 mm
- Termination Style :
- Solder
Beschreibung
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
Teil | Hersteller | Lager | Beschreibung |
---|---|---|---|
PP400-0.009-AC-50 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, 1 Side Adhesive, Sil-Pad TSP PP900/Poly-Pad 400 |
HF625-0.005-00-82 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, Hi-Flow THF 500/Hi-Flow 625 |
PP1000-0.009-00-46 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP PP1200/Poly-Pad 1000 |
HF300P-0.001-00-62 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change Material, 0.001 Inch Thick, Hi-Flow THF 1600P/Hi-Flow 300P |
SP1200-0.009-00-48 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009 Inch Thick, Sil-Pad TSP 1800/aka Sil-Pad 1200 |
PPK10-0.006-00-60 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP PPK1300/Poly-Pad K-10 |
SP800-0.005-00-58 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
SPK10-0.006-AC-60 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006" Thick, 1 Side Adhesive, Sil-Pad TSP K1300/Sil-Pad K-10, K10AC-60 |
QII-0.006-00-77 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP Q2500/aka Q-Pad II |
HF625-0.005-AC-31 | Bergquist Company | 3,000 | Thermal Interface Products Phase Change TIM, 0.005 Inch Thick, 1 Side Adhesive, Hi-Flow THF 500/Hi-Flow 625 |
SP400-0.007-00-43 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.007 Inch Thick, Sil-Pad TSP 900/Sil-Pad 400 |
SP800-0.005-00-131 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800 |
SP1100ST-0.012-02-99 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad 0.012 Inch Thick, Sil-Pad TSP 1100ST/aka Sil-Pad 1100ST |
SPK4-0.006-00-136 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.006 Inch Thick, Sil-Pad TSP K900/Sil-Pad K-4 |
SPA1500-0.010-00-114 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.010 Inch Thick, Sil-Pad TSP A2000/Sil-Pad A1500 |