sales@szcinty.com
Produktübersicht
- Artikelnummer
- FTE-145-01-G-DV-ES-A
- Hersteller
- Samtec
- Produktkategorie
- Board-to-Board- und Mezzanine-Steckverbinder
- Beschreibung
- Board to Board & Mezzanine Connectors 0.80 mm Surface Mount Micro Terminal Strip
Dokumente & Medien
- Datenblätter
- FTE-145-01-G-DV-ES-A
Produkteigenschaften
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 2.7 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 90 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 0.8 mm
- Product :
- Headers
- Series :
- FTE
- Termination Style :
- Solder
Beschreibung
Board to Board & Mezzanine Connectors 0.80 mm Surface Mount Micro Terminal Strip
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
| Teil | Hersteller | Lager | Beschreibung |
|---|---|---|---|
| 2233003 | Bergquist Company | 3,000 | Thermal Interface Products GAP PAD, GAP PAD TGP 1100SF Series / GAP PAD 1000SF Series |
| GPVOUS-B-0.040-AC-0816 | Bergquist Company | 3,000 | Thermal Interface Products GAP PAD, 8x16" SH, 0.04", Adhesive, GAP PAD TGP1000VOUSB/GAP PAD VO UltraSoft-B |
| 2167683 | Bergquist Company | 3,000 | Thermal Interface Products Economical, Insulator, 0.01" Thick, 0.866x0.650", Sil-Pad TSP 1500/Sil-Pad 1500 |
| GPHC1000-0.015-02-0816 | Bergquist Company | 3,000 | Thermal Interface Products GAP PAD, 8x16"SH, 0.015", GAP PAD TGPHC1000/GAP PAD HC1000 |
| TIC1000A-00-00-200CC | Bergquist Company | 3,000 | Thermal Interface Products Compound for High-End Computer Processors, 200CC Syringe, TGR 1500A/TIC 1000A |
| 2649718 | Bergquist Company | 3,000 | Thermal Interface Products High Performance Insulator, Sil-Pad TSP K1300/aka Bergquist Sil-Pad K-10 |
| 2198625 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 1.14x1.65 Inch, Sil-Pad TSP Q2500/aka Q-Pad II |
| 2478430 | Bergquist Company | 3,000 | Thermal Interface Products GAP PAD, GAP PAD TGP 5000/GAP PAD 5000S35 |
| SP1500-0.010-00-102 | Bergquist Company | 3,000 | Thermal Interface Products Economical, Insulator, 0.010 Inch Thick, 1500-102, Sil-Pad TSP 1500/Sil-Pad 1500 |
| 2629442 | Bergquist Company | 3,000 | Thermal Interface Products GAP PAD, Ultra-Low Modulus, GAP PAD TGP 3500ULM/GAP PAD 3500ULM |
| 2257008 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 0.009" Thick, Dimensions: 0.650x0.865 Inch, Sil-Pad TSP 900/Sil-Pad 400 |
| 2214475 | Bergquist Company | 3,000 | Thermal Interface Products GAP PAD, 0.02" Thick, 3.15x4.84 Inch, GAP PAD TGP 5000/GAP PAD 5000S35 |
| 2180411 | Bergquist Company | 3,000 | Thermal Interface Products Sil-Pad, 12x23mm, 0.885g, Sil-Pad TSP 1300CAP/Sil-Pad CAP |
| 2413730 | Bergquist Company | 3,000 | Thermal Interface Products GAP PAD, 0.01", 22.86x12.7mm, GAP PAD TGP HC3000/GAP PAD HC 3.0 |
| GF2000-00-600-1200CC | Bergquist Company | 3,000 | Thermal Interface Products Liquid Gap Filler, 1200CC Kit, Gap Filler TGF 2000/Gap Filler 2000 |
