Produktübersicht

Artikelnummer
FW-03-03-G-D-300-065
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch

Dokumente & Medien

Datenblätter
FW-03-03-G-D-300-065

Produkteigenschaften

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Straight
Number of Positions :
6 Position
Number of Rows :
2 Row
Pitch :
1.27 mm
Product :
Headers
Series :
FW-SM
Termination Style :
Solder

Beschreibung

Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch

Preis & Beschaffung

Zugehöriges Produkt

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    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
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    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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