Produktübersicht

Artikelnummer
HW-03-08-T-D-235-125
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch

Dokumente & Medien

Datenblätter
HW-03-08-T-D-235-125

Produkteigenschaften

Contact Material :
Phosphor Bronze
Contact Plating :
Tin
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Straight
Number of Positions :
6 Position
Number of Rows :
2 Row
Packaging :
Bulk
Pitch :
2.54 mm
Product :
Headers
Series :
HW
Stack Height :
5.969 mm
Termination Style :
Solder

Beschreibung

Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch

Preis & Beschaffung

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