Produktübersicht

Artikelnummer
ZW-03-14-G-S-1080-230
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 0.100 Pitch

Dokumente & Medien

Datenblätter
ZW-03-14-G-S-1080-230

Produkteigenschaften

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Housing Material :
Polyester
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
3 Position
Number of Rows :
1 Row
Packaging :
Bulk
Pitch :
2.54 mm
Product :
Headers
Series :
ZW
Stack Height :
2.7432 mm
Termination Style :
Solder

Beschreibung

Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 0.100 Pitch

Preis & Beschaffung

Zugehöriges Produkt

  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6VQG100C
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C256-6TQG144C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C32A-6VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44C
  • Xilinx
    CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
  • Xilinx
    CPLD - Complex Programmable Logic Devices XC2C64A-7VQG44I
  • STMicroelectronics
    Microprocessors - MPU MPU ARM926 Cortex 8-ch DMA 32KB Rom
  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

Das könnte Sie auch interessieren

Teil Hersteller Lager Beschreibung
MT40A1G16KD-062E IT:E Micron 3,000 DRAM DDR4 16G 1GX16 FBGA
MT53E1G32D2FW-046 AUT:A Micron 3,000 DRAM LPDDR4 32G 1GX32 FBGA DDP
MT62F1G64D8EK-031 AIT:B Micron 2,380 DRAM LPDDR5 64G 1GX64 FBGA 8DP
MT53E256M32D2FW-046 AAT:B Micron 3,000 DRAM LPDDR4 8G 256MX32 FBGA DDP
MT53E1G32D2FW-046 AAT:A Micron 3,000 DRAM LPDDR4 32G 1GX32 FBGA DDP
IS43QR16256A-083RBLI ISSI 3,000 DRAM 1.2V 2400 MT/s 4Gb 256Mx16 DDR4 SDRAM
W634GU6NB12I Winbond 3,000 DRAM 4Gb DDR3L 1.35V SDRAM, x16, 800MHz, Industrial Temp
MT53E512M32D2FW-046 WT:D Micron 3,000 DRAM LPDDR4 16G 512MX32 FBGA
IS41C16105C-50TLI ISSI 3,000 DRAM 16M, 5V, 50ns 1Mx16 Fast Page DRAM
MT53E768M32D4DE-046 IT:E TR Micron 3,000 DRAM LPDDR4 24G X32 TFBGA
MT62F1G64D8EK-031 AAT:B Micron 3,000 DRAM LPDDR5 64G 1GX64 FBGA 8DP
MT61K256M32JE-21:T Micron 3,000 DRAM GDDR6 8G 256MX32 FBGA
IS41C16256C-35TLI ISSI 3,000 DRAM 4M, 5V, EDO DRAM 35ns, 40 pin TSOP II
IS41C16100C-50TLI ISSI 3,000 DRAM 16M, 5V, 50ns 1Mx16 EDO DRAM Async
APS256XXN-OBR-WA AP Memory 3,000 DRAM IoT RAM 256Mb OPI (x8,x16) DDR 200MHz, 1.8V, Ind. Temp., WLCSP