Produktübersicht

Artikelnummer
TW-18-03-G-T-160-160
Hersteller
Samtec
Produktkategorie
Board-to-Board- und Mezzanine-Steckverbinder
Beschreibung
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch

Dokumente & Medien

Datenblätter
TW-18-03-G-T-160-160

Produkteigenschaften

Contact Material :
Phosphor Bronze
Contact Plating :
Gold
Current Rating :
5.2 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Vertical
Number of Positions :
54 Position
Number of Rows :
3 Row
Packaging :
Bulk
Pitch :
2 mm
Product :
Connectors
Series :
TW
Stack Height :
4.06 mm
Termination Style :
Solder

Beschreibung

Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch

Preis & Beschaffung

Zugehöriges Produkt

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  • STMicroelectronics
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  • STMicroelectronics
    Embedded - CPLDs (Complex Programmable Logic Devices)

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