sales@szcinty.com
Produktübersicht
- Artikelnummer
- DW-24-20-T-S-865
- Hersteller
- Samtec
- Produktkategorie
- Board-to-Board- und Mezzanine-Steckverbinder
- Beschreibung
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header with Fixed Tail Length, 0.100 Pitch
Dokumente & Medien
- Datenblätter
- DW-24-20-T-S-865
Produkteigenschaften
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Tin
- Housing Material :
- Polyester
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 24 Position
- Number of Rows :
- 1 Row
- Packaging :
- Bulk
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- DW
- Stack Height :
- 0.865 in
- Termination Style :
- Solder Pin
Beschreibung
Board to Board & Mezzanine Connectors Flexible Board Stacking Header with Fixed Tail Length, 0.100 Pitch
Preis & Beschaffung
Zugehöriges Produkt
Das könnte Sie auch interessieren
| Teil | Hersteller | Lager | Beschreibung |
|---|---|---|---|
| 680-75A | Wakefield-Vette | 265 | Heat Sinks Maximum Efficiency Omnidirectional Heat Sink T03, T0220 |
| 394-1AB | Wakefield-Vette | 115 | Heat Sinks Low Profile Performance Heat Sink for IGBTs & Power Modules |
| 657-15ABPEN | Wakefield-Vette | 1,827 | Heat Sinks High Performance Heat Sink for Vertical Board Mounting TO-220, TO-227, TO-218 |
| 6225B-MTG | Aavid, Thermal Division of Boyd Corporation | 4,425 | Heat Sinks Space-Saving Style, Board Level, Stamped Heat Sink for TO-220, Staggered Fins, Vertical Mounting, 15 n Thermal Resistance, Black Anodized |
| APF40-40-10CB/A01 | CTS Electronic Components | 428 | Heat Sinks 40x40x10mm Double-sided Kapton |
| PF758G | Aavid, Thermal Division of Boyd Corporation | 702 | Heat Sinks Slide-On Style, Board Level Heat Sink with Integrated Tabs for TO-220, Vertical Mounting, 17.3 n Thermal Resistance, Tin Plated, 24x5.2mm |
| 122547 | Wakefield-Vette | 47 | Heat Sinks High Aspect Heat Sink for Power Module |
| 510-12U | Wakefield-Vette | 23 | Heat Sinks High Fin Density Heat Sinks for Power Modules, IGBTs & Relays |
| MAX09NG | Aavid, Thermal Division of Boyd Corporation | 18,990 | Heat Sinks Max Clip System for TO-220, 10mm Width, 0.5mm Thickness, 45N Force |
| 374724B00035G | Aavid, Thermal Division of Boyd Corporation | 1,960 | Heat Sinks Heat Sink for Plastic BGA Packages, Black Anodized, 35x35x18mm, IC Pkg Size = 35 x 35, Tape #35 |
| 904-27-1-12-2-B-0 | Wakefield-Vette | 428 | Heat Sinks Chipset Heat Sink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum, Black Anodized |
| 260-4TH5E | Wakefield-Vette | 108 | Heat Sinks Cup Clips for TO-5 Case Style Semiconductors, 3.18mm Tapped Base Depth |
| 563202D00000G | Aavid, Thermal Division of Boyd Corporation | 6,333 | Heat Sinks Board Level, Stamped Heat Sink for TO-220, Vertical Mounting, Tin Finish, 50.8x35.05x12.70mm |
| 510-9M | Wakefield-Vette | 25 | Heat Sinks High Fin Density Heat Sinks for Power Modules, IGBTs & Relays |
| HS26 | Apex Microtechnology | 8 | Heat Sinks Heatsink, Open Frame |
